Hummingbird Scientific Electrical Biasing TEM Holder with wirebonded 6-pin chip

Biasing

Technical Specs

TEM Sample Holder - Electrical Biasing - FEI Model
  1600 Series
Tilt Range ±45° depending on microscope and pole piece
Number of Electrical Contacts 6, 8, or 9 *
Contact Type Flexible wirebond contacts or fixed spring contact
Carrier Removable Sample Carrier
Carrier Compatibility Any Standard TEM Sample Supports
Sample Size Fits up to 3 x 6mm samples
Wiring Standard or low-noise shielded
TEM Compatibility TFS/FEI, JEOL, Hitachi, Zeiss

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Features

Featured Research

Temperature mapping on the nanoscale

Microelectronic devices can be simultaneously seen and tested with a biasing holder—taking advantage of the TEM’s analytical toolbox, like in this example, where the in-situ TEM biasing holder and EELS are used to capture changes in temperature. A team led by UCLA demonstrate a noncontact thermometric technique to measure bulk temperatures with nanometer-scale spatial resolution using plasmons.

Reference:  B.C. Regan et al. Nanoscale temperature mapping in operating microelectronic devices. Science (2015). Abstract

Copyright © 2016 by the American Association for the Advancement of Science

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Joule heating and EELS spectrum of Al device. Image copyright © 2016 by the American Association for the Advancement of Science

Video Spotlight

Using our electrical biasing holder, researchers at Penn State have demonstrated the room temperature dislocation-based plasticity and tremendous flaw tolerance of TiN film, which in bulk form is a brittle material. TiN loading was conducted using a MEMS device containing electro-thermal actuators. The researchers surmise that room-temperature dislocation activities resulted from the nucleation of pre-existing dislocations, which resulted from residual compressive stresses developed during deposition. As a result, the TiN films were tougher than the Ti films in the tested multilayers. The movie shows the dislocation movement at the crack tip following loading at room temperature.

Reference: S. Kumar, D.E. Wolfe, M.A Haque. “Dislocation shielding and flaw tolerance in titanium nitride,” International Journal of Plasticity 27:5 (2011) pp. 739–747 . Abstract

Movie copyright © 2010, Elsevier Ltd.  All rights reserved.

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Selected Publications

Edward R. White, Jared J. Lodico & B. C. Regan. “Intercalation events visualized in single microcrystals of graphite,” Nature Communications (2017) Abstract
Nathanael Jöhrmann, Steffen Hartmann, Kiran Jacob, Jens Bonitz, Kathrine E. MacArthur, Sascha Hermann, Stefan E. Schulz, Bernhard Wunderle. “A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load,” 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (2017) Abstract
J.J. Lodico, E.R. White, W.A. Hubbard, E. Garcia, B. Parks, B. Zutter, B.C. Regan. In-Situ Scanning Transmission Electron Microscopy (STEM) of Individual Electrochemical Intercalation Events in Graphite,” Microscopy and Microanalysis (2015)  Abstract
M.L. Taheri. Toward Deterministic Switching in Ferroelectric Systems: Insight Gained from In-Situ TEM,” Microscopy and Microanalysis (2015)   Abstract
M.-S. Hsiao, Y. Yuan, C. Grabowski, A. Nie, R. Shabazian-Yassar, L.F. Drummy.In-Situ TEM Characterization of Nanostructured Dielectrics,” Microscopy and Microanalysis (2015)   Abstract
W.A. Hubbard, E.R. White, A. Kerelsky, G. Jasmin, J. Lodico. Time-Resolved Imaging of Electrochemical Switching in Nanoscale Resistive Memory Elements,” Microscopy and Microanalysis (2015)   Abstract
B.C. Regan, W.A. Hubbard, E.R. White, R. Dhall, S.B. Cronin, S. Aloni, M. Mecklenburg. Introduction to Plasmon Energy Expansion Thermometry,” Microscopy and Microanalysis (2015)  Abstract
M.H. Mecklenburg, W.A. Hubbard, E.R. White, R. Dhall, S. Cronin, S. Aloni, B.C. Regan. Applications of Plasmon Energy Expansion Thermometry,” Microscopy and Microanalysis (2015)  Abstract
M. Mecklenburg, W. A. Hubbard,E. R. White, Rohan Dhall, S. B. Cronin, S. Aloni, and B. C. ReganNanoscale temperature mapping in operating microelectronic devices, Science (2015) Abstract
M. Puster, J.A. Rodríguez-Manzo, A. Balan, M. Drndić. “Toward Sensitive Graphene Nanoribbon-Nanopore Devices by Preventing Electron Beam-Induced Damage,” ACS Nano (2013) Abstract
E. Hosseinan, O.N. Pierron, Quantitative in situ TEM tensile fatigue testing on nanocrystalline metallic ultrathin films,” Nanoscale (2013) Abstract
C.R. Winkler, M.L. Jablonski, A.R. Damodaran, K. Jambunathan, L.W. Martin, M.L. Taheri. Accessing Intermediate Ferroelectric Switching Regimes With Time-Resolved Transmission Electron Microscopy, Journal of Applied Physics (2012) Abstract
C.R. Winkler, A.R. Damodaran, J. Karthik, L.W. Martin, M.L. Taheri. Direct Observation of Ferroelectric Domain Switching in Varying Electric Field Regimes Using In-Situ TEM,” Micron (2012) Abstract
S. Kumar, D.E. Wolfe, M.A. Haque. “Dislocation Shielding and Flaw Tolerance in Titanium Nitride,” International Journal of Plasticity (2011) Abstract
S. Kumar, D. Zhuo, D.E. Wolfe, A. Eades, M.A. Haque. “Length-Scale Effects on Fracture of Multilayers,” Scripta Materialia (2010) Abstract
C.M. Wang, W. Xu, J. Liu, D.W. Choi, B. Arey, L.V. Saraf, J.G. Zhang, Z.G. Yang, S. Thevuthasan, D.R. Baer, N. Salmon. “In-situ transmission electron microscopy and spectroscopy studies of interfaces in Li ion batteries: Challenges and opportunities,” Journal of Materials Research(2010) Abstract
S. Kumar, M.A. Haque. “Fracture Testing of Nanoscale Thin Films inside the Transmission Electron Microscope,” International Journal of Applied Mechanics (2010) Abstract
D.T. Schoen, S. Meister, H. Peng, C. Chan, Y. Yangb, Y. Cuia. “Phase transformations in one-dimensional materials: applications in electronics and energy sciences,” Journal of Materials Chemistry (2009) Abstract
H. Minoda, K. Hatano, H. Yazawa. “Development of a surface conductivity measurement system for ultrahigh vacuum transmission electron microscope,” Review of Scientific Instruments  (2009) Abstract
S. Kumar, M.A. Haque, H. Gao. “Notch-Insensitive Fracture in Nanoscale Thin Films,” Applied Physics Letters (2009) Abstract
S. Meister, D.T. Schoen, M.A. Topinka, A.M. Minor, Y. Cui.  ”Void Formation Induced Electrical Switching in Phase-Change Nanowires,”Nano Letters (2008) Abstract
H. Peng, C. Xie, D.T. Schoen, and Y. Cui. “Large Anisotropy of Electrical Properties in Layer-Structured In2Se3 Nanowires,” Nano Letters (2008) Abstract

 

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